Summit Interconnect: Complex boards. Clear paths forward.

Quick-turn prototype support, production PCB expertise, and a consistent engineering interface as programs move from early builds into larger quantity requirements.

Engineering review and design-for-manufacturability support to help optimize stackups, materials, drilling, via structures, finishes, and manufacturing approach.

Advanced PCB fabrication plus turnkey assembly options, supporting SMT, through-hole, fine-pitch components, BGA work, conformal coating, and box-build needs.

HDI rigid PCBs with dense routing, microvias, blind and buried vias, back drilling, via fill, metal core options, and large panel capability.

Specialized PCB support for RF and high-frequency designs, including low-loss materials, tight tolerance drilling, bondable gold, and signal-integrity driven layouts.

Rigid-flex, bookbinder, multilayer flex, adhesiveless and adhesive constructions, stiffeners, laser ablation, and thin flex laminate experience.

Full turnkey prototype assembly options for engineering builds, rapid evaluation, and flexible manufacturing support when schedule matters.

Thermal management PCB technologies designed to improve heat dissipation and long-term reliability in high-power and demanding environments.

Support for complex semiconductor test applications such as reference cards, probe cards, DUT boards, burn-in boards, and high-performance interconnect needs.